CSC Energia Data Infrastructure designs and delivers micro-modular data centers, edge data centers, immersion liquid cooling, AI servers, liquid cooling switches, cold aisle containment, DCIM/EMS, ser...
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1.6T-DR8 OSFP224 LPO 1.6T-DR8 OSFP224 LPO based on silicon photonics w/o DSP. 8 channels of 200G-PAM4 electrical and optical parallel lanes,500m maximum reach via single mode fiber,case
Hot pluggable electrical interface based on IEEE 802.3ba standard and SFF-8436 Supports 40Gb/s data rate links up to 2km over SMF Typical Power dissipation: 2.7W Single 3.3V power supply.
The Broadcom® BCM87800 is the industry''s highest-performance and lowest-power single-chip 800GbE PAM-4 PHY transceiver capable of driving eight lanes of 106-Gb/s PAM-4 at 53 Gbaud,
CN168P-124-0001 CFP8 Plug Connector Up to 112G PAM4/64G-NRZ/56G-NRZ per differential pair Current Capacity up to 2.2A for latest generation of DCO Connector, plug and mechanical sets
Built-in Broadcom DSP Chip, Max. Power Consumption 18W. Parameter Tests for
FTCF2519E1PCM is a 1.6T-DR8 OSFP transceiver with dual MPO-12, 8x200G PAM4, and RoHS-6 compliance, featuring digital diagnostics via I2C.
CN168C-124-0002 CFP8 Single Cage Up to 112G PAM4/64G-NRZ/56G-NRZ per differential pair Current Capacity up to 2.2A for latest generation of DCO Connector, plug and mechanical sets
Built-in Broadcom DSP Chip, Max. Power Consumption 18W. Parameter Tests for Superior Performance, Quality, and Reliability. Self-developed 106G EML Laser Chip to Ensure Production.
DC common-mode voltage is generated by the host. Specification includes effects of ground offset voltage. The signaling rate range is derived from the PMD receiver input. IV. Average launch power,
Built-in Broadcom DSP Chip, it is compatible with Cisco N9364E-SG2-O switch and engineered to maintain reliable operation under varying temperature, humidity, and EMI conditions. The OSFP
FTCF2519E1PCM is a 1.6T-DR8 OSFP transceiver with dual MPO-12, 8x200G
Prefabricated micro-modular data centers and edge pods, scalable from 5 to 50 racks, ready for 5G and edge AI workloads.
Single-phase immersion cooling tanks and direct-to-chip liquid cooling switches, achieving PUE below 1.1.
GPU-accelerated AI servers, high-density server racks, and network cabinets optimized for AI/ML workloads.
Real-time data center infrastructure management, plus overhead cable trays and fiber bridges for structured cabling.
We provide custom data center infrastructure solutions, from micro-modular DCs to immersion cooling and AI-ready racks.
From design to deployment, our team ensures energy-efficient, scalable, and carrier-grade digital infrastructure.
Al. Jerozolimskie 180, Entrance B, 02-486 Warsaw, Masovian Voivodeship, Poland
+48 571 392 846 | +48 571 392 846 | +49 152 346 7918 | +49 152 346 7918 | [email protected]