Discover how this revolutionary photonic interconnect technology is changing the game for Artificial Intelligence (AI) infrastructure by enabling massive scale-up bandwidth and radix, connecting GPUs,...
Contact online >>
Siluxtek: Leverages its full-stack technical capabilities in high-speed silicon photonic chip design, packaging and testing and system solutions. It takes the lead in the architectural design,
osstalk penalties, unlocking the design space for ultra-broadband Kerr comb–driven DWDM links. In this study, we present our latest design and characterization of a SiPh microresonator-based DWDM
This integration of photonics and networking silicon will likely be done in a multi-chip package, leveraging the developments made in semiconductor packaging and taking advantage of using the
Rethinking the limits of AI, Lightmatter merges photonics and computing to build a future where speed, efficiency, and intelligence converge.
This dual advantage positions silicon photonics as a critical enabler for next-generation computing architectures, particularly as conventional electronic systems approach fundamental
We demonstrate a programmable silicon photonic chip with an intelligent configuration framework, enabling on-chip computing, signal processing, switching, and encryption.
There are two silicon photonics (SIP) chips, denoted by SIP Tx (transmitter) and SIP Rx (receiver). Those chips are very small and are hidden under the Heat Sink. The Heat Sink transfers
In this paper, monolithically integrated silicon photonic transmitter and receiver with an ultra-high-capacity density of 37.0 Tbps/cm 2 were proposed and demonstrated by introducing hybrid
NTT''s photonic-electronic convergence (PEC) device replaces electronic switches with optical alternatives, reducing the power needed to move terabits of data per second.
The technological essence of silicon photonic integrated circuits is to utilize the mature complementary metal oxide semiconductor (CMOS) technology, or the processes compatible with
Prefabricated micro-modular data centers and edge pods, scalable from 5 to 50 racks, ready for 5G and edge AI workloads.
Single-phase immersion cooling tanks and direct-to-chip liquid cooling switches, achieving PUE below 1.1.
GPU-accelerated AI servers, high-density server racks, and network cabinets optimized for AI/ML workloads.
Real-time data center infrastructure management, plus overhead cable trays and fiber bridges for structured cabling.
We provide custom data center infrastructure solutions, from micro-modular DCs to immersion cooling and AI-ready racks.
From design to deployment, our team ensures energy-efficient, scalable, and carrier-grade digital infrastructure.
Al. Jerozolimskie 180, Entrance B, 02-486 Warsaw, Masovian Voivodeship, Poland
+48 571 392 846 | +48 571 392 846 | +49 152 346 7918 | +49 152 346 7918 | [email protected]